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E-Bond© 590 Hi-Mod Gel Epoxy | Part A (Resin)

E-Bond© 590 Hi-Mod Gel Epoxy | Part A (Resin)

SKU 590 HI-MOD GEL EPOXY
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E-BOND© 590 HI-MOD GEL EPOXY  PART A – RESIN

E-Bond 590 Hi-Mod Gel is a structural adhesive system for grouting anchor bolts, sealing cracks, and setting injection ports prior to injection grouting. E-Bond 590 Hi Mod Gel is recommended for bonding wheel stops to concrete and asphalt surfaces.

ADVANTAGES:

  • Insensitive to moisture before, during and after cure Easy mixing ratio of 1 to 1 for the two components
  • Gel / Paste consistency
  • Provides excellent adhesion to most structural materials Provides high early strength within 24 hours.
  • Low Temperature cures as low as 40F**
  • Zero VOC - Fully reactive, No low boiling constituents

E-BOND 590 HI-MOD conforms to ASTM-C-881, Type I and IV, Grade 3, Class B and C, AASHTO-M235-91